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        • 商品名称: Y-P6337-D-900
        • 商品编号: Y-P6337-D-900
        • 上架时间: 2014-01-06
        • 浏览次数: 639
        • 已销售数量:0件

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        有铅锡膏  Y-P6337-D-900
        描述
        Y系列是一种低残留,免清洗焊锡膏,它被设计用于提高SMT生产线的产能。其流变优化的助焊膏载体配方能提供优良的可重复印刷性以及对环境条件的适应性。Y系列的活性系统经过优化,用以强化焊点焊接性能,减少锡球其他焊接缺陷,能提供长期的可靠性。
         
        Y系列宽泛的回流焊窗口可以允许使用此锡膏用于焊接无铅元器件,测试证明对于具有0201镀锡原件和1mm间距的SAC305锡球的BGA元器件的复杂组装件都能焊接。
         
        Y series is a low residue,no-clean solder paste designed to maximize SMT line yields.The flux vehixle is rheologically formulated to provide excellent repeatability and resistance to environmentar conditione.The Y series activation system has been optimized to enhance joint solderability,solderballs and other soldering defects while maintaining long term reliability.Minimizing defects requires robust and repeatale processe,equipment and materials.
         
        Y seies’s wids reflow profile window enables soldering of lead free components with this tin lead paste.Tests show that complex assemblies with small(0201)tin finished passives,and large(1 mm pitch)BGA components with SAC 305 spheres can be assembled.small print deposits remain fully coalesced,even in profiles hot enough to collapse SAC 305 BGA spheres.
         
        特性
        此产品本身黏度偏大,做BGA类型元件有空洞低,但是适合连续印刷不易出现短路现象。主要针对手机,电脑主板等高端产品。
         
        焊接规格Solder Specfications
        焊接合金之成分Composition of solder alloy
         
         

        组成(质量%)Composition of solder alloy
        SN PB
        余量Balance 37.0±0.5%
         
        焊接合金之物理性质Solder alloy physical properties
        熔融温度Melting points(°C)
        液相线Liquidus DSC峰值DSC peak 固相线Solidus
        183.0 183.0 183.0
         
         
        密度(g/cm3)
        Density
        拉伸强度(Mpa)
        Tensile Strength
        延伸率(%)
        Elongation
        楊氏模量(Gpa)
        Young’s Module
        0.2%屈服点(Mpa)
        0.2%Yield Point
        维氏硬度(Hv)
        Vickers Hardness
        8.4 56 59 26.3 45.8 16.6
         
        锡粉规格Solder powder specification
        类型Type 目数Mesh 粒度分布PSD(um)
        T4 -400/+635 20-38
         
        技术数据
        物理性质Physical properties
        项目Ctegory 值/结果Values/Results 测试方法/说明Methods/Remarks
        外观
        Appearance
        外观灰白色,圆滑膏状,无明显分层。Shall not have separarated flux,and shall be in smooth paste state 目视 Visual inspection
        金属含量%
        Metal  Loading%
        90.00 IPC-TM- 650 2.2.20
        粘度
        Viscosity Pa.S
         
        180±30 pa.s JIS-Z-3284 6@ Malcom PCU-205:10RPM
        3Min 25±1°C<60%RH
        粘着性
        Tack
        Initial:75.6 gm Takc retention @ 24 hr: 120.2 gm Tack retention @ 72 hr: 96 gm JIS Z-3284 9
        扩散率%
        Spread Test%
        >80% JIS-Z-3197-8.3.1.1
        锡球实验
        Solder Ball Test
        可接受Acceptable Ipc –TM-650 2.4.43
        坍塌测试
        Slump Test
        No bridges all spacings IPC-TM-650 2.4.35
        印刷寿命
        Stencil Life
        >4小时Hours @50%RH,23°C(74°F)
        再印刷留置时间
        A bandon Time
        30-60分钟 Minutes @50%RH,23°C(74°F)
         
        化学性质Chemical properties
        活性级别
        Activity Level
        ROLI IPC J-STD-004
        卤素含量 ppm
        Halide content ppm
        >1500ppm IPC-TM-650 2.3.28.1
        铜镜腐蚀
        Copper Mirror
        没有腐蚀发生,NO Corrosion Occur IPC-TM-650 2.3.32
        铜板腐蚀 Copper Corrosion 没有腐蚀发生,NO Corrosion Occur IPC-TM-650 2.6.15
        电气性能
        表面絕緣阻抗
        SIR
        Pass,Test Conditions:IPC 7 days @ 85°C 85% RH IPC J-STD-004 Pass condition:≥1×108ohm min IPC-TM-650,2.6.3.3
        電遷移
        Electromigration
        Pass,Test Conditions:65°C,88.5% RH for 596 hrs IPC-TM-650,2.6.14.1

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