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  • 商品名称: TF220-M305-D-885
  • 商品编号: TF220-M305-D-885
  • 上架时间: 2015-11-04
  • 浏览次数: 992
  • 已销售数量:0件

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TF220-M305-D-885

 

产品描述:
对环境污染的控制已成为经济发展中的首要义题,锡铅焊料是一种高度有毒的金属合金,它作为组装辅料被广泛用于现代电子组装工业。随着欧美RoHS指令的实施,电子产品制造商已经趋向于焊料的无铅化。
The control of environmental pollution has been considered as top priorities in economy development.Tin-lead solder is a highly poisomous metal alloy to used widely in modern modern assemble industry as assemable material .As EU RoHS directive adaptep and the electronic manufactuer has move to ward to lead-free process.
 
由同方公司研发的TF220系列焊锡膏为客户提供优良的可焊性与印刷型。TF220系列焊锡膏解决了无铅焊料在应用中出现的各种问题,如:储存于 运输稳定性,润湿性差以及由高温焊料导致的锡膏不耐热性。
TF220 series solder paste was developed by TongFang company,which provide excellent and printbility to meet customer’s needs.The TF220 series solves various prob lems as the implementation of lead-free solder.suceh asstorage stability,delivery stality,poorsolder wettability,and poor solder paste heat resistance caused by the high temperature solder.
 
产品特性:
该产品是残留物无色透明,活性适中,BGA空洞率低,手动印刷不费力,主要用于中高端产品,如DVD,机顶盒等
 
产品规格:Solder Specfications


合金成分Composition of solder alloy

组成(质量%)Composition(Mass%)
SN AG CU
余量Balance 3.0±0.2% 0.5±0.1%

 

焊接合金之物理性质Solder alloy physical properties

熔融温度Melting points(°C)
液相线Liquidus DSC峰值DSC peak 固相线Solidus
218.0 220.0 217.0

 

密度(g/cm3)
Density
拉伸强度(Mpa)
Tensile Strength
延伸率(%)
Elongation
杨氏模量(Gpa)
Young’s Module
0.2%屈服点(Mpa)
0.2%Yield Point
维氏硬度(Hv)
Vickers Hardness
7.38 53.3 46 41.6 39.4 17.9
 
锡粉规格Solder powder specification
类型Type 目数Mesh 粒度分布PSD(um)
T4 -400/+635 20-38

 
技术数据:


物理性质Physical properties

项目Ctegory 值/结果Values/Results 测试方法/说明Methods/Remarks
外观
Appearance
外观灰白色,圆滑膏状,无明显分层。Shall not have separarated flux,and shall be in smooth paste state 目视 Visual inspection
金属含量%
Metal  Loading%
88.50 JIS –Z- 3197 8.1.2
粘度
Viscosity Pa.S
 
170±30 pa.s  JIS-Z-3284 6@ Malcom PCU-205:10 rpm 3 min 25±1°C<60% RH
粘着性
Tack
Initial:75.6 gm Takc retention @ 24 hr: 120.2 gm Tack retention @ 72 hr: 96  gm JIS- Z- 3284 9
扩散率%
Spread Test%
>80% JIS-Z-3197-8.3.1.1
锡球实验
Solder Ball Test
可接受Acceptable JIS-Z-3284 11
坍塌测试
Slump Test
所有间距无桥接No bridges all spcings JIS-Z-3284 7,8
印刷寿命
Stencil Life
>8小时Hours @50%RH,23°C(74°F)
再印刷留置时间
A bandon Time
30-60分钟 Minutes @50%RH,23°C(74°F)
 
化学性质Chemical properties
活性级别
Activity Level
ROL0 IPC J-STD-004
卤素含量 ppm
Halide content ppm
>1500ppm JIS Z-3197 8.1.4.2.1
铜镜腐蚀
Copper Mirror
No removal of copper film 无铜层剥离 JIS Z-3197 8.4.2
铜板腐蚀 Copper Corrosion 没有腐蚀发生,NO Corrosion Occur IPC-TM-650 2.6.15

 
电气性能

表面绝缘阻抗
SIR
Ordinary state 1×1012(Ω)or above After humidifying 1×109(Ω)or above After 100hrs.in humidity JIS  Z 3284-14
電遷移
Electromigration
Pass,Tess Conditions:65°C,88.5% RH for 596 hrs IPC-TM-650,2.6.14.1